Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Kukdo Chemical KD-293X Epoxy Resin

Kukdo KD-293X is a low-temp curing modified solid bisphenol A epoxy resin in KD series, designed for low-temp high-efficiency curing of special functional powder coatings. It is white micro-powder solid with ultra-low curing temp, reduced energy consumption, good chemical resistance and flexibility, excellent adhesion to heat-sensitive substrates, ideal for special functional coating.

Features Of Kukdo Chemical KD-293X Epoxy Resin

  • Ultra-low curing temperature - Curing temp as low as 120-140℃, suitable for heat-sensitive substrate coating

  • Molecular modification optimization - Modified structure enhances film flexibility with excellent anti-cracking performance

  • Excellent chemical resistance - Resists erosion of organic solvents, acid and alkali media with stable protection

  • Heat-sensitive substrate adaptation - 0-grade adhesion to plastic composite substrates and low-temp sensitive metals

  • High-efficiency film-forming characteristics - Good dispersibility of micro-powder, uniform spraying without agglomeration

Typical Applications Of Kukdo Chemical KD-293X Epoxy Resin

  • Heat-sensitive composite substrate coating - Low-temp curing protective coating for plastic-metal composite parts

  • Special coating for electronic appliances - Low-temp protective functional coating for heat-sensitive electronic components

  • Special coating for automotive interiors - Decorative protective coating for heat-sensitive automotive interior parts

  • Coating for high-end toy accessories - Low-temp safe coating for plastic toy metal accessories

  • Protective coating for precision instruments - Low-temp functional coating for heat-sensitive precision instrument enclosures

Specifications Of Kukdo Chemical KD-293X Epoxy Resin

TypeLow-Temp Curing Modified Solid Bisphenol A Epoxy Resin
Chemical CategoryModified Bisphenol A Epoxy Resin
Epoxy Equivalent (g/mol)240-270
Softening Point (℃)65-75
Melt Viscosity (130℃, mPa·s)15-30
Gel Time (140℃, sec)60-90
Volatile Content (%)≤0.2
Curing Temperature (℃)120-140
Curing Time (min)20-25
Adhesion (Grade)0
Impact Resistance (kg·cm)≥40


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