Kukdo KD-293X is a low-temp curing modified solid bisphenol A epoxy resin in KD series, designed for low-temp high-efficiency curing of special functional powder coatings. It is white micro-powder solid with ultra-low curing temp, reduced energy consumption, good chemical resistance and flexibility, excellent adhesion to heat-sensitive substrates, ideal for special functional coating.
Ultra-low curing temperature - Curing temp as low as 120-140℃, suitable for heat-sensitive substrate coating
Molecular modification optimization - Modified structure enhances film flexibility with excellent anti-cracking performance
Excellent chemical resistance - Resists erosion of organic solvents, acid and alkali media with stable protection
Heat-sensitive substrate adaptation - 0-grade adhesion to plastic composite substrates and low-temp sensitive metals
High-efficiency film-forming characteristics - Good dispersibility of micro-powder, uniform spraying without agglomeration
Heat-sensitive composite substrate coating - Low-temp curing protective coating for plastic-metal composite parts
Special coating for electronic appliances - Low-temp protective functional coating for heat-sensitive electronic components
Special coating for automotive interiors - Decorative protective coating for heat-sensitive automotive interior parts
Coating for high-end toy accessories - Low-temp safe coating for plastic toy metal accessories
Protective coating for precision instruments - Low-temp functional coating for heat-sensitive precision instrument enclosures
| Type | Low-Temp Curing Modified Solid Bisphenol A Epoxy Resin |
| Chemical Category | Modified Bisphenol A Epoxy Resin |
| Epoxy Equivalent (g/mol) | 240-270 |
| Softening Point (℃) | 65-75 |
| Melt Viscosity (130℃, mPa·s) | 15-30 |
| Gel Time (140℃, sec) | 60-90 |
| Volatile Content (%) | ≤0.2 |
| Curing Temperature (℃) | 120-140 |
| Curing Time (min) | 20-25 |
| Adhesion (Grade) | 0 |
| Impact Resistance (kg·cm) | ≥40 |
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