The brand is KUKDO, the series is KD Series, the model is KD-2113. It is a high-performance liquid epoxy resin developed for PC materials and multi-substrate bonding, presenting as black viscous liquid. With excellent adhesion to PC, metal and other substrates, it cures quickly and has good toughness after forming
Wide substrate adaptability - Excellent bonding performance to PC materials, while compatible with metal, plastic and other substrates.
High curing efficiency - Can be cured in 30 minutes at medium temperature, greatly improving production efficiency.
Outstanding bonding strength - Forms a high-strength bonding layer after curing, with strong peeling and impact resistance.
Reasonable operation window - The pot life at 25℃ is up to 3 days, facilitating mass production operations.
Good molding stability - Low shrinkage during curing, high dimensional accuracy of bonded components.
Electronic encapsulation - Sealing and bonding fixation of PC electronic casings and components.
Home appliance assembly - Structural bonding of PC panels and metal brackets in home appliances.
Auto parts - Bonding and sealing protection of automotive PC lampshades and interior parts.
Communication equipment - Assembly and bonding of PC components and metal interfaces in communication equipment.
General bonding - Structural bonding and waterproof encapsulation of small multi-material components.
| Type | Two-component liquid epoxy resin |
| Chemical Category | General-purpose bonding epoxy resin |
| CAS No. | 25068-38-6 |
| Viscosity (25℃, cps) | 25000 |
| Thixotropic Index (TI) | 4.9 |
| Glass Transition Temperature (Tg, ℃) | 44 |
| Curing Condition | 30min @80℃ |
| Pot Life at 25℃ (days) | 3 |
| Bonding Shear Strength (PC-PC, MPa) | ≥8.5 |
| Bonding Shear Strength (PC-Steel, MPa) | ≥10.2 |
| Temperature Resistance Range (℃) | -40~120 |
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