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Low-viscosity, reactive liquid epoxy resin enabling excellent flow and wet-out in demanding formulations.
High epoxide equivalent weight (EEW) of approximately 185–195 g/eq, providing balanced reactivity and extended working life.
Excellent compatibility with common amine and anhydride curing agents for tailored thermal and mechanical performance.
Superior adhesion to metals, composites, and cured polymer substrates without requiring surface priming.
Consistent batch-to-batch quality meeting stringent Dow manufacturing controls and ISO-certified processes.
Aerospace composite matrix resins for primary and secondary structural components.
High-performance electrical encapsulants and potting compounds for power electronics and EV battery modules.
Structural adhesive formulations requiring elevated Tg and long-term durability under thermal cycling.
Wind turbine blade bonding and infusion resins where low viscosity and controlled gel time are critical.
Advanced tooling and mold-making systems for carbon fiber composite production.
| Chemical Type | Bisphenol-F based diglycidyl ether |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, low-viscosity liquid at 25°C |
| Epoxide Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–16,000 cP |
| Chloride Content | ≤ 1,000 ppm |
| Primary Applications | Composite matrices, structural adhesives, electrical encapsulation |
| Key Features | Low viscosity, high purity, consistent reactivity, excellent adhesion |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
