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High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured epoxy substrates without surface priming.
Low viscosity (11,000–13,000 cP at 25°C) enabling easy handling, impregnation, and air-release in casting and laminating processes.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good thermal stability with glass transition temperature (Tg) up to 125°C after full cure with DDS hardener.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural bonding in wind turbine blade assembly and aerospace composite components.
Castings for precision tooling, jigs, and industrial molds requiring dimensional stability.
Laminating resin for high-performance fiberglass and carbon fiber prepregs.
Underfill and glob-top encapsulation in power electronics modules.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to water-white, transparent |
| Epoxy Equivalent Weight (EEW) | 165–175 g/eq |
| Viscosity (25°C) | 11,000–13,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤ 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
