Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO SM618 Epoxy Resin

KUKDO SM618 Epoxy Resin is a high-performance bisphenol-A based liquid epoxy resin offering excellent adhesion thermal stability and chemical resistance ideal for composites coatings and electrical encapsulation applications widely used in aerospace automotive and electronics industries.
  • kukdo sm618 epoxy resin_272ca913
  • kukdo sm618 epoxy resin_272ca913

Features Of KUKDO SM618 Epoxy Resin

  1. High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.

  2. Excellent adhesion to metals, composites, and treated plastics without primer requirement.

  3. Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing, impregnation, and air release.

  4. Superior thermal stability with glass transition temperature (Tg) up to 125°C after post-cure.

  5. Low chloride content (<0.02 wt%) ensuring high electrical insulation performance and corrosion resistance.

Typical Applications Of KUKDO SM618 Epoxy Resin

  1. Electrical encapsulation of power modules, IGBTs, and high-voltage sensors.

  2. Structural adhesive formulation for aerospace composite bonding and automotive lightweight assemblies.

  3. Matrix resin for filament-wound pressure vessels and CFRP piping systems.

  4. Insulating varnish for stators, rotors, and transformer windings in industrial motors.

  5. Base resin for high-performance composite tooling and mold-making applications.

Specifications Of KUKDO SM618 Epoxy Resin

Chemical TypeBisphenol-F based liquid epoxy resin
Product FormClear, low-viscosity liquid
AppearancePale yellow to amber, transparent
Epoxy Equivalent Weight (EEW)178–184 g/eq
Viscosity (25°C)12,000–15,000 cP
Chloride Content≤0.02 wt%
Softening PointNot applicable (liquid at room temperature)
Primary ApplicationsEncapsulation, structural adhesives, composite matrix, electrical insulation


Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *