High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without primer requirement.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing, impregnation, and air release.
Superior thermal stability with glass transition temperature (Tg) up to 125°C after post-cure.
Low chloride content (<0.02 wt%) ensuring high electrical insulation performance and corrosion resistance.
Electrical encapsulation of power modules, IGBTs, and high-voltage sensors.
Structural adhesive formulation for aerospace composite bonding and automotive lightweight assemblies.
Matrix resin for filament-wound pressure vessels and CFRP piping systems.
Insulating varnish for stators, rotors, and transformer windings in industrial motors.
Base resin for high-performance composite tooling and mold-making applications.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to amber, transparent |
| Epoxy Equivalent Weight (EEW) | 178–184 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | ≤0.02 wt% |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Encapsulation, structural adhesives, composite matrix, electrical insulation |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China