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High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured epoxy substrates without surface priming.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy processing via casting, impregnation, and filament winding.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good thermal stability with glass transition temperature (Tg) of 120–125°C after full cure with DDS.
Electrical encapsulation and potting of high-voltage transformers and busbar insulators.
Matrix resin for filament-wound pressure vessels and composite tanks in industrial gas storage.
Structural adhesive formulation for aerospace secondary bonding and metal-to-composite joining.
Insulating coating for copper windings in electric motors and generators.
Core material in laminated busbars and DC-link capacitors for power electronics modules.
| Chemical Type | Diglycidyl ether of bisphenol-F (BPF) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Amber to pale yellow transparent liquid |
| Epoxy Equivalent Weight (EEW) | 178–184 g/eq |
| Viscosity (25°C) | 10,000–12,000 mPa·s |
| Chloride Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | ≥ 12 months at <25°C in sealed original container |
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