High activity & fast curing - High epoxy functional group content, fast reaction speed with curing agents, enabling rapid cross-linking and curing
Low melt viscosity & easy processing - Low melt viscosity, easy to dissolve and disperse, convenient to add and operate, suitable for various processing technologies
High purity & low impurities - Extremely low content of hydrolyzable chlorine and impurities, stable performance of cured products, excellent electrical insulation
Extremely wide compatibility - Good compatibility with various curing agents, solvents and additives, suitable for both water-based and solvent-based systems
Heavy anti-corrosion coatings - Formulation of two-component heavy anti-corrosion primers and topcoats for steel structures, marine engineering and chemical equipment
Industrial adhesives - Structural adhesives for metals and composite materials, suitable for high-strength bonding requirements in industrial manufacturing
Composite materials - Basic molding raw materials for epoxy-based composite materials and FRP products, improving the mechanical properties of products
Electronic packaging materials - Packaging and potting materials for electronic components and transformers, ensuring electrical insulation performance
| Resin Type | Bisphenol A type low molecular weight solid epoxy resin |
| Epoxy Equivalent (g/eq) | 180~200 |
| Epoxy Value (eq/100g) | 5.00~5.56 |
| Softening Point (℃) | 45~55 |
| Melt Viscosity (mPa·s/150℃) | ≤800 |
| Hydrolyzable Chlorine (%) | ≤0.05 |
| Color (Gardner) | ≤0.5 |
| Water Content (%) | ≤0.3 |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China