High-purity, low-chloride phenolic novolac-type epoxy resin for enhanced electrical insulation performance.
Excellent thermal stability and glass transition temperature (Tg) suitable for high-reliability electronic encapsulation.
Low ionic impurities ensuring superior moisture resistance and long-term reliability in humid environments.
Optimized reactivity profile for controlled cure kinetics with standard amine or anhydride hardeners.
Consistent batch-to-batch quality certified to ISO 9001 and compliant with RoHS Directive 2011/65/EU.
Encapsulation and molding compounds for semiconductor devices and power modules.
High-voltage insulating components in electric vehicle (EV) power electronics.
Underfill materials for flip-chip and advanced packaging applications.
Printed circuit board (PCB) laminates requiring high Tg and dimensional stability.
Adhesives and bonding agents for aerospace-grade composite assemblies.
| Chemical Type | Phenolic Novolac Epoxy Resin |
| Product Form | Off-white to light yellow solid pellets |
| Appearance | Free-flowing granular solid at room temperature |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Softening Point | 85–92 °C |
| Chloride Content | ≤ 300 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Primary Applications | Electronic encapsulation, high-Tg laminates, and thermosetting composites |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China