LG Chem LC875 is a low-density POE with high fluidity, good flexibility and low temperature impact resistance, featured with low heat-sealing temperature and excellent impact modification effect, suitable for automotive interior & exterior parts and plastic modification fields.
High fluidity with MFR 33g/10min, suitable for injection molding and other processes, with good mold fillability and high processing efficiency
Good flexibility and impact resistance, Shore A 55 for superior flexibility, low temperature impact resistant, greatly improving the impact performance of substrates
Low heat-sealing temperature, easy for heat-sealing and molding operations, reducing processing energy consumption, suitable for film heat-sealing processes
Efficient impact modifier, significantly improving the impact strength and flexibility of PP, PE, PA and other materials with excellent modification effect
Excellent low temperature resistance, Tg -53.0℃, maintaining toughness at low temperatures without embrittlement risk
Automotive Field: Interior & exterior parts (bumpers, fenders, steering wheels, base plates), low temperature impact resistant, enhancing component durability
Rubber & Plastic Modification: Modification of PP/PE/PA and other materials, significantly improving the impact strength and flexibility of substrates, suitable for multi-category modification needs
Wires & Cables: Insulation and sheathing materials, with good heat and environmental resistance, ensuring the stability and safety of wiring use
Industrial Products: Hoses, conveyor belts, rubber cloth, molded products, with both flexibility and impact resistance, suitable for industrial working conditions
General Fields: Medical devices, home appliances, stationery & sports goods, toys, packaging films, food/cosmetic hose packaging, safely applicable to multiple civil scenarios
| Physical Properties | |
| Density | 0.870 g/cm³ |
| Shore A Hardness | 55 (ASTM D2240) |
| Thermal Properties | |
| Glass Transition Temperature | -53.0 °C |
| Melting Temperature | 57 °C |
| Melt Flow Properties | |
| Melt Flow Rate (190°C/2.16kg) | 33 g/10 min (ASTM D1238) |
| Mechanical Properties | |
| Elongation at Break | >400 % (ASTM D638) |
| Flexural Modulus (1% Secant) | 10 MPa (ASTM D790) |
| Tear Strength | 14 kN/m (ASTM D624) |
Q1: What is the primary polymer matrix compatibility of LC875?
A: LG Chem LC875 is specifically engineered for use in rigid PVC formulations, where it enhances impact resistance without compromising dimensional stability or processability. It demonstrates good compatibility with standard PVC resins and common stabilizer systems used in extrusion and injection molding applications.
Q2: How does LC875 affect processing behavior during extrusion or calendering?
A: LC875 is designed to maintain favorable melt rheology in PVC compounds, supporting smooth extrusion and reduced die swell. It typically does not significantly increase melt viscosity at recommended dosage levels and contributes to stable torque profiles during compounding and shaping processes.
Q3: Is LC875 suitable for applications requiring weather resistance or long-term outdoor performance?
A: Yes — LC875 contributes to improved retention of impact strength after UV exposure and thermal aging in PVC profiles and siding applications. Its structure supports compatibility with standard UV absorbers and HALS stabilizers commonly used in weatherable PVC compounds.
Q4: What is the typical dosage range for LC875 in rigid PVC formulations?
A: LC875 is typically used at low concentrations, generally ranging from 0.1% to 2% by weight relative to the PVC resin, depending on the target impact performance, final part geometry, and regulatory or performance requirements of the end application.
Q5: Does LC875 require special handling or drying prior to compounding?
A: LC875 is supplied as a free-flowing, dry granular material and does not require pre-drying under standard ambient storage conditions. However, prolonged exposure to high humidity should be avoided to maintain optimal feeding consistency during high-speed compounding.
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