Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Kukdo Chemical SM-685 Epoxy Resin

SM-685 is a premium modified epoxy resin in Kukdo’s SM series, designed for precision electronic packaging and high-performance structural bonding. It features excellent substrate adhesion and stable curing performance, maintaining bonding reliability under severe thermal shock.

Features Of Kukdo Chemical SM-685 Epoxy Resin

  • High-adhesion formula - Firmly bonds to metal, plastic, PCB and other substrates

  • All-liquid active system - 100% active ingredients, solvent-free and eco-friendly, ready for use

  • Excellent thermal shock resistance - Withstands severe thermal shock after curing, stable performance at high temperatures

  • Low-shrinkage curing - Low curing shrinkage, reducing component stress damage

  • Superior electrical properties - Excellent insulation, ensuring safe operation of electronic components

Typical Applications Of Kukdo Chemical SM-685 Epoxy Resin

  • Electronic component packaging - Potting protection for transistors, semiconductor components and inductance coils

  • Precision electronic bonding - Fixing of PCB electronic components and bonding protection of IC chips

  • Electrical component sealing - Sealing and moisture-proofing for relays, capacitors, triggers and other components

  • Automotive electronic components - Bonding and protective packaging of automotive electronic components

  • Motor component fixing - Positioning and structural bonding of internal motor components

Specifications Of Kukdo Chemical SM-685 Epoxy Resin

AppearanceLight Yellow Transparent Liquid
Epoxy Equivalent (g/eq)230-250
Viscosity (25℃, cps)3800-5800
Color (G)≤8
Hydrolyzable Chlorine (ppm)≤300
Solid Content (%)100
Density (20℃, g/cm³)1.16-1.18
Glass Transition Temperature (Tg, ℃)110-120
Adhesion (Tensile Strength, MPa)≥5
Volume Resistivity (Ω·cm)≥1.0×10¹⁴
Temperature Range (℃)-55~150
Curing Shrinkage (%)≤2.0


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