English
Español
tiếng việt
русский
High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent mechanical strength and chemical resistance after full cure, especially against alkalis and solvents.
Low viscosity (3,500–4,500 cP at 25°C) enabling easy processing, impregnation, and air release.
Good adhesion to metals, composites, and treated plastics without primer requirement.
Consistent batch-to-batch quality meeting ISO 9001-certified manufacturing standards.
Electrical insulation systems for dry-type transformers and reactor windings.
Structural adhesive formulations for aerospace composite bonding and repair.
Encapsulation and potting of high-voltage electronic components and sensors.
Matrix resin in filament-wound pressure vessels and FRP piping systems.
Tooling and mold-making applications requiring dimensional stability and low shrinkage.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) |
| Product Form | Liquid |
| Appearance | Clear, pale yellow, transparent liquid |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 3,500–4,500 cP |
| Chloride Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤ 25°C in sealed original container |
Q1: What is the primary function of KUKDO SM604 in epoxy formulations?
A: KUKDO SM604 is a reactive diluent designed to reduce viscosity and improve processability of standard bisphenol-A or bisphenol-F based epoxy resins without significantly compromising crosslink density or thermal performance.
Q2: Is KUKDO SM604 suitable for high-gloss coating applications?
A: Yes — due to its low volatility, good compatibility, and ability to support excellent film formation, SM604 is commonly used in high-performance industrial coatings where surface aesthetics, hardness, and chemical resistance are critical.
Q3: How does SM604 compare to non-reactive diluents in terms of final properties?
A: Unlike non-reactive diluents, SM604 participates in the curing reaction, helping retain mechanical strength, Tg, and chemical resistance in the cured network — while still delivering effective viscosity reduction during processing.
Q4: Can SM604 be used in heat-cured powder coating systems?
A: Yes — SM604 is compatible with common epoxy-amine and epoxy-anhydride cure chemistries used in thermosetting powder coatings, and contributes to improved melt flow and edge coverage at typical cure schedules.
Q5: What safety considerations should be observed when handling SM604?
A: As with most epoxy reactive diluents, appropriate personal protective equipment (PPE) including gloves and eye protection is recommended. Ensure adequate ventilation during handling to minimize inhalation exposure, and consult the Safety Data Sheet for detailed occupational hygiene guidance.
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
