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High-purity bisphenol-A based solid epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low volatile organic compound (VOC) content for safer processing.
Optimized melt viscosity for improved flow and wetting in powder coating and casting applications.
Superior adhesion to metals, composites, and cured thermoset substrates.
Compatible with standard amine and anhydride hardeners for broad formulation flexibility.
Powder coatings for architectural aluminum, appliances, and automotive components.
Electrical encapsulation and potting compounds for transformers, sensors, and PCBs.
High-performance composite matrices in wind turbine blades and aerospace structural parts.
Adhesives and structural bonding films for metal-to-metal and metal-to-composite joints.
| Chemical Type | Bisphenol-A based solid epoxy resin |
| Product Form | Off-white to light tan granular solid |
| Appearance | Free-flowing granules, no visible impurities |
| Epoxy Equivalent Weight (EEW) | 470–490 g/eq |
| Melt Viscosity (150°C) | 8,000–12,000 cP |
| Glass Transition Temperature (Tg) | 65–72°C (DSC, 10°C/min) |
| Volatile Content (120°C, 2 hrs) | ≤0.3 wt% |
| Softening Point (Ring & Ball) | 82–87°C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
