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High purity Bisphenol A-based epoxy resin with consistent molecular weight distribution.
Optimized for excellent adhesion to metals, composites, and cured polymer substrates.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing and improved wetting in formulations.
Superior thermal stability and chemical resistance after curing with standard amine or anhydride hardeners.
Compliant with RoHS and REACH regulations; free of intentional bisphenol F and halogenated solvents.
Electrical encapsulation and potting compounds for power modules and transformers.
Structural adhesives in automotive and aerospace composite bonding.
High-performance coating systems for corrosion protection of steel infrastructure.
Matrix resin for fiber-reinforced laminates used in wind turbine blades and marine components.
Printed circuit board (PCB) solder mask and dielectric layer formulations.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Transparent, slightly yellow, homogeneous liquid |
| Epoxy Equivalent Weight (EEW) | 470–490 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | ≤ 800 ppm |
| Softening Point | 12–15°C |
| Volatiles (150°C, 2 h) | ≤ 0.3 wt% |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
