Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

SK Chemicals 851L Impact Modifier

SK POE851L is an ultra-low density POE with high elasticity, excellent low temperature resistance and low shrinkage, significant toughening effect, suitable for multi-field modification and molding.

Features Of SK Chemicals 851L Impact Modifier

  1. Significant toughening effect, greatly improving the toughness and impact resistance of substrates, suitable for high durability application environments

  2. Excellent low temperature resistance, glass transition temperature of -53℃, stable performance without embrittlement in low temperature environment

  3. Low shrinkage rate, effectively ensuring the dimensional stability of products, suitable for precision molding requirements

  4. Good processability with excellent fluidity, fast mold filling in injection molding, shortening production cycle and improving efficiency

Typical Applications Of SK Chemicals 851L Impact Modifier

  1. Automotive Industry: Impact modification of bumpers, instrument panels and other parts, high impact resistance and dimensional stability

  2. Electrical Industry: Electrical insulation parts and connectors, stable performance, improving product durability

  3. Cable Industry: Insulation and sheathing layers of wires and cables, excellent insulation and wear resistance, suitable for wiring protection

Specifications Of SK Chemicals 851L Impact Modifier

Physical Properties
Density0.857 g/cm³
Shore A Hardness55 (ASTM D2240)
Shore D Hardness12 (ASTM D2240)
Melt Flow & Thermal Properties
Melt Flow Rate (190°C/2.16kg)1.0 g/10 min (ASTM D1238)
Glass Transition Temperature-53 °C
Mechanical Properties
Tensile Strength6.08 MPa (ASTM D638)
Elongation at Break1000 % (ASTM D638)












































































































































Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *