Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Allnex VIACRYL VSC 6286w/45WA Acrylic Resin

Allnex VIACRYL VSC 6286w/45WA from Allnex's VIACRYL series waterborne styrene-acrylic emulsion range for multi-substrate general use is a high-performance solvent-free self-crosslinking styrene-acrylic copolymer emulsion developed specifically for industrial metal, automotive OEM and industrial wood fields. Adopting water-based technology, it has low/zero VOC emissions with green advantages, featuring self-curing and low-temperature curing properties

Features Of Allnex VIACRYL VSC 6286w/45WA Acrylic Resin

  1. Solvent-free and environmentally friendly - No solvent added in the whole system, low/zero VOC emissions, meeting multi-region environmental regulations, safe construction with no odor.

  2. Self-curing and low-temperature adaptable - No additional curing agent needed, can self-crosslink and cure at low temperature, simplifying construction process and reducing energy consumption and construction costs.

  3. Strong adhesion to multi-substrates - Excellent adhesion to various substrates such as metal, plastic and wood, adapting to coating needs in multiple fields.

Typical Applications Of Allnex VIACRYL VSC 6286w/45WA Acrylic Resin

  1. Automotive OEM parts coating: Protective and decorative coatings for automotive interior plastic parts and metal structural parts, adapting to low-temperature curing process requirements.

  2. Industrial wood coating preparation: Water-based varnish/topcoat coating for solid wood furniture and industrial wood components, ensuring non-yellowing appearance and durability.

  3. General industrial metal coating: Protective coatings for hardware accessories and industrial equipment casings, improving corrosion resistance and adhesion performance.

Specifications Of Allnex VIACRYL VSC 6286w/45WA Acrylic Resin

AppearanceMilky white liquid (typical value)
Solid Content44-46% (wt%)
pH Value (25℃)7.0-8.5
Viscosity (25℃, Brookfield, mPa·s)700-1800
Minimum Film Formation Temperature (MFT)10-16℃
Curing CharacteristicsSelf-curing, low-temperature curing (curing can be accelerated at ≥60℃)
Acid Value≤12 mg KOH/g (typical value)


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