Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Kukdo Chemical KD-410J Epoxy Resin

Kukdo KD-410J is a phenol-excess low-temp fast-cure solid bisphenol A epoxy resin in KD series, designed for low-energy high-performance powder coating systems. It is milky white solid particles, featuring fast curing at low temperature, reducing baking energy consumption, with excellent mechanical strength, chemical resistance and substrate adhesion, compatible with epoxy and polyester resins, ideal for energy-saving industrial coatings.

Features Of Kukdo Chemical KD-410J Epoxy Resin

  • Low-temp fast curing & energy-saving - Fast curing at low temperature, reducing baking energy consumption by over 30% and improving production efficiency

  • Phenol-excess formula optimization - Optimized molecular structure enhances film chemical resistance and mechanical stability

  • High-density film formation - Pinhole-free and shrinkage-free film, combining decoration and protection performance

  • Wide substrate adaptation - 0-grade adhesion to carbon steel, stainless steel, aluminum alloy and other metal substrates

  • Multi-system compatibility - Excellent adaptability with epoxy, polyester resins and various additives, flexible formula

Typical Applications OfKukdo Chemical KD-410J Epoxy Resin

  • Energy-saving powder coatings - Large-scale production of epoxy/polyester hybrid low-temp curing powder coatings

  • Precision hardware protection - Low-temp high-efficiency protective coating of temperature-sensitive precision hardware

  • Automotive lightweight parts - Low-temp curing protective coating of aluminum alloy automotive parts

  • Smart home enclosures - Energy-saving decorative protective coating of smart home metal enclosures

  • Rail transit accessories - Low-temp curing coating of rail transit lightweight metal accessories

Specifications Of Kukdo Chemical KD-410J Epoxy Resin

Chemical CategoryBisphenol A Epoxy Resin (Phenol-Excess Type)
Epoxy Equivalent (g/mol)235-255
Hydroxyl Equivalent (g/mol)115-125
Softening Point (℃)75-83
Melt Viscosity (150℃, mPa·s)30-45
Gel Time (180℃, sec)45-65
Volatile Content (%)≤0.3
Impact Resistance (kg·cm)≥50
Adhesion (Grade)0
Curing Temperature (℃)140-160
Curing Time (min)15-20


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