Dow SYL-OFF SL 18 Release Modifier is a high-performance solvent-free release modifier in the SYL-OFF series, designed for optimizing the release performance of low-temperature curing PEK release paper. It can precisely adjust and stabilize the release force of release paper, with excellent formulation compatibility and processing adaptability, efficiently improving the reliability of release substrates
Solvent-Free & Eco-Safe - No volatile solvents, meeting eco-friendly processing requirements
Low-Temp Curing Adaptability - Designed for low-temperature processes, ensuring PEK paper curing effect
Stable & Controllable Release Force - Precisely adjusts release force, stable at low and high peel speeds
Efficient Modification - Excellent release modification effect with small addition amount
PEK Release Paper Coating - Release modification of low-temperature curing PEK paper, improving release stability
Pressure-Sensitive Tape Release - Coating of release substrates for tapes, ensuring uniform peeling effect
Label Release Materials - Release treatment of label substrates, optimizing adhesion and peeling performance
Industrial Release Film Preparation - Functional modification of single/double-sided industrial release films
| Brand | DOW |
| Chemical Composition | Silicone-based release modified polymer (100% Active Ingredient) |
| Appearance | Clear to slightly hazy, viscous liquid |
| Solution Viscosity | 750 Centipoise (cP) |
| Specific Gravity (25℃) | 1 |
| Flash Point (Closed Cup) | >100℃ |
| Active Ingredient | 100% |
| Shelf Life | 540 Days (from date of manufacture) |
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E-mail: wangxingqiang@ericwchem.com
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