BYK-1790 is a non-silicone defoamer specifically designed for solvent-free radiation curing systems, including wood coatings, industrial paints, printing inks, and adhesives. As a polymer-based defoamer, it works effectively in both pigmented and non-pigmented formulations, ensuring optimal performance of the systems and enhancing the surface quality of the end products. It efficiently reduces foam, improves application properties, and boosts overall product efficiency, making it an ideal choice for various coating and adhesive applications in the chemical industry.
Non-silicone Composition: Free of silicones, avoiding potential surface defects that may be caused by silicone-based defoamers, making it suitable for scenarios with high surface quality requirements.
Broad Applicability: Effective in both pigmented and non-pigmented formulations, covering a wide range of applications.
Tailored for Radiation Curing Systems: Specifically designed for solvent-free radiation curing systems, with good compatibility and adaptability to their curing characteristics.
Wood Coatings: Used in radiation curing coatings for wood surfaces to reduce foam during application, ensuring a smooth and flat coating.
Industrial Paints: Applied in radiation curing paints for various industrial products, improving the coating effect and surface performance of finished products.
Printing Inks: Functions in radiation curing systems of printing inks, preventing foam from affecting printing precision and pattern quality.
Adhesives: Utilized in solvent-free radiation curing adhesives to reduce bubble formation, ensuring the bonding strength and uniformity of adhesives.
Density (at 20°C) | 0.85 g/ml |
Non-volatile content (10 minutes, 150°C) | 100% |
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E-mail: wangxingqiang@ericwchem.com
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