High reactivity with epoxy resins, enabling rapid gelation and reduced cycle times.
Excellent low-temperature curing capability down to 5°C without compromising final mechanical properties.
Low viscosity (250–350 mPa·s at 25°C) ensures easy handling, precise metering, and superior wetting of fillers and reinforcements.
Non-halogenated formulation meets stringent environmental and safety requirements for electronics and aerospace applications.
Provides outstanding thermal stability and glass transition temperature (Tg > 140°C) in cured networks.
Encapsulants and potting compounds for high-reliability power electronics.
Structural adhesives in automotive lightweighting assemblies.
Prepregs and infusion resins for carbon fiber composites in wind energy blades.
Electrical insulation coatings for transformers and busbars.
Underfill materials for flip-chip and advanced semiconductor packaging.
| Chemical Type | Amine-functionalized aliphatic polyether |
| Product Form | Liquid |
| Appearance | Clear, pale yellow liquid |
| Density (25°C) | 1.02–1.05 g/cm³ |
| Viscosity (25°C) | 250–350 mPa·s |
| Amine Value | 380–420 mg KOH/g |
| Reactivity Profile | Fast-curing, latent-modified system |
| Storage Stability | ≥12 months at ≤25°C in sealed container |
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E-mail: wangxingqiang@ericwchem.com
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