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Fast-reacting aliphatic amine adduct designed for ambient and low-temperature curing of epoxy resins.
Low viscosity (< 500 mPa·s at 25°C) enables excellent mixing, wetting, and penetration into porous substrates.
Low volatility and negligible odor—meets stringent industrial hygiene and VOC compliance requirements.
Provides outstanding flexibility, impact resistance, and chemical resistance in cured epoxy systems.
Compatible with standard DGEBA and modified epoxy resins without pre-drying or special handling.
Structural adhesives for automotive assembly and lightweight composite bonding.
High-performance flooring and coating systems in pharmaceutical and food-processing facilities.
Electrical potting and encapsulation compounds requiring thermal stability and dielectric integrity.
Repair mortars and grouts for concrete infrastructure rehabilitation.
Wind turbine blade bonding and leading-edge protection coatings.
| Chemical Type | Aliphatic amine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Density (25°C) | 0.92–0.95 g/cm³ |
| Viscosity (25°C) | 350–480 mPa·s |
| Amine Value | 220–240 mg KOH/g |
| Primary Applications | Epoxy resin curing for adhesives, coatings, and composites |
| Key Features | Ambient-cure capability, low exotherm, low toxicity profile |
Q1: What types of resin systems is HDX-75D-1 compatible with?
A: HDX-75D-1 is specifically formulated for use with epoxy resins, including liquid bisphenol-A and bisphenol-F types, as well as certain modified epoxy systems. It is not recommended for use with polyurethane, polyester, or acrylic resin chemistries without prior compatibility testing.
Q2: How does HDX-75D-1 affect cure speed and final film properties?
A: HDX-75D-1 provides moderate reactivity at ambient to elevated temperatures, enabling good pot life control while supporting efficient crosslinking. Final cured films typically exhibit enhanced chemical resistance, improved hardness, and reduced residual stress compared to conventional amine-based curing agents.
Q3: What is the recommended dosage range for HDX-75D-1 in epoxy formulations?
A: Dosage depends on formulation requirements, target performance, and resin functionality—but HDX-75D-1 is typically used at low concentrations, generally ranging from 0.1% to 2% by weight relative to the epoxy resin. Optimization should be performed through small-scale trials under actual processing conditions.
Q4: Does HDX-75D-1 require special handling or storage conditions?
A: Yes—HDX-75D-1 should be stored in tightly sealed containers under dry, cool conditions (preferably below 25°C) and protected from moisture and direct sunlight. Prolonged exposure to humidity may affect reactivity and shelf life. Standard industrial hygiene practices apply during handling, including appropriate ventilation and personal protective equipment.
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