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Low-viscosity liquid enabling easy handling and homogeneous mixing with epoxy resins.
Offers extended pot life at ambient temperatures while delivering rapid cure development upon mild heating.
Provides excellent flexibility and impact resistance in cured epoxy systems.
Delivers low exotherm during cure—ideal for thick-section or large-part applications.
Compatible with standard bisphenol-A and bisphenol-F epoxy resins.
Structural adhesives for aerospace and transportation bonding.
Composite matrix resins for wind turbine blade manufacturing.
Electrical encapsulants and potting compounds requiring thermal stability and low stress.
High-performance coatings for industrial flooring and corrosion protection.
Tooling and mold-making compounds where dimensional stability is critical.
| Chemical Type | Fatty amine adduct |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, free of sediment or haze |
| Primary Applications | Epoxy resin curing agent for structural composites and adhesives |
| Key Features | Low viscosity, extended pot life, flexible cured network |
| Benefits | Improved toughness, reduced internal stress, ease of processing |
| Storage Conditions | Store in original sealed container at 15–25°C; protect from moisture |
| Shelf Life | 12 months from date of manufacture under recommended storage |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
