Fast-reacting aliphatic amine-based curing agent for room-temperature and elevated-temperature epoxy systems.
Excellent chemical resistance—particularly to alkalis, solvents, and mild acids after full cure.
Low viscosity (200–300 mPa·s at 25°C) ensures easy handling, precise metering, and superior wetting of fillers and substrates.
Low volatility and non-crystallizing nature provide extended pot life and consistent processing stability.
Produces tough, flexible cured films with high impact resistance and low exotherm in thick-section applications.
High-performance epoxy flooring and industrial coatings for warehouses and cleanrooms.
Structural adhesives for automotive composites and metal-to-composite bonding.
Electrical encapsulants and potting compounds requiring thermal cycling stability.
Repair mortars and grouts for concrete rehabilitation in infrastructure projects.
Wind turbine blade bonding and lightning protection system primers.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Density (25°C) | 0.92–0.95 g/cm³ |
| Viscosity (25°C) | 220–280 mPa·s |
| Amine Value | 320–360 mg KOH/g |
| Reactivity Profile | Medium reactivity; gel time ~45–60 min (with DGEBA resin, 100 phr, 23°C) |
| Primary Applications | Epoxy coatings, adhesives, encapsulants, and repair systems |
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E-mail: wangxingqiang@ericwchem.com
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