Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

​Evonik AEROSIL R805 Hydrophobic Fumed Silica

Evonik AEROSIL R805 is a hydrophobic fumed silica imported from Germany, modified with octylsilane. It is designed for polar systems and anti-corrosion coatings, delivering precise rheology control, excellent anti-settling and powder flow aid properties for adhesives, sealants and epoxy coatings.

Features Of Evonik AEROSIL R805 Hydrophobic Fumed Silica

  1. Octylsilane hydrophobic modification – Uniform surface treatment, strong hydrophobic stability, suitable for various polar and non-polar systems

  2. Rheology control in complex systems – Stable thixotropy in two-component epoxy and other complex liquids, anti-sagging and easy to construct

  3. Pigment anti-settling & anti-corrosion enhancement – Improves pigment suspension stability, enhances coating density and anti-corrosion protection

  4. High-efficiency flow aid for powder coatings – Improves powder fluidity and dispersion, reduces caking, enhances spraying uniformity

  5. Wide and stable system compatibility – Excellent chemical inertness, good compatibility with resins and additives, no impact on system performance

Typical Applications Of Evonik AEROSIL R805 Hydrophobic Fumed Silica

  1. Industrial adhesives and sealants

  2. Industrial paints and anti-corrosion coatings

  3. Two-component epoxy resin multi-coat systems

  4. Powder coating flow aid and anti-caking

  5. Unsaturated polyester and gel coat systems

Specifications Of Evonik AEROSIL R805 Hydrophobic Fumed Silica

BrandEvonik
Product SeriesAEROSIL Hydrophobic Fumed Silica
Product TypeHydrophobic Fumed Silica (White Carbon Black)
Surface TreatmentOctylsilane
BET Surface Area150±25 m²/g
Bulk Densityapprox. 50 g/L
Carbon Content4.5–6.5 wt%
Moisture Content≤0.5 wt%
Loss on Ignition5.0–7.0 wt%
pH Value (4% Dispersion)3.5–5.5
SiO₂ Content≥99.8 w


Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *