High reactivity with epoxy resins, enabling rapid room-temperature or low-temperature curing.
Excellent chemical resistance post-cure, including resistance to acids, alkalis, and solvents.
Low viscosity and good miscibility with standard bisphenol-A and novolac epoxy systems.
Low volatility and negligible amine blush formation, supporting high-gloss, defect-free surface finishes.
Halogen-free formulation compliant with RoHS and REACH regulatory requirements.
Electronics encapsulation and underfill for semiconductor packaging.
High-performance structural adhesives in automotive and aerospace assemblies.
Electrical insulation coatings and potting compounds for power electronics.
Composite matrix resins for carbon fiber-reinforced polymer (CFRP) tooling and molds.
High-durability protective coatings for industrial flooring and chemical containment linings.
| Chemical Type | Aromatic amine-based polyadduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Density (25°C) | 1.08–1.12 g/cm³ |
| Viscosity (25°C) | 300–600 mPa·s |
| Amine Value | 240–270 mg KOH/g |
| Primary Applications | Epoxy resin curing for electronics, composites, and adhesives |
| Key Features | Fast ambient cure, halogen-free, low blush, high Tg capability |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China