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Latent reactivity enables extended pot life at ambient temperatures, supporting efficient processing and handling.
Activates rapidly upon thermal trigger (typically >120 °C), delivering fast and consistent epoxy crosslinking.
Halogen-free formulation meets stringent environmental and regulatory requirements for electronics and aerospace end uses.
Excellent compatibility with standard DGEBA and novolac epoxy resins ensures broad formulation flexibility.
Yields cured systems with high glass transition temperature (Tg), superior thermal stability, and low dielectric loss.
High-performance encapsulants and glob-tops for semiconductor packaging and microelectronics.
Prepregs and composite matrices in aerospace structural components requiring low outgassing and high Tg.
Electrical insulation varnishes and impregnating resins for motors, generators, and transformers.
Adhesives and bonding agents for demanding automotive power electronics modules.
| Chemical Type | Latent amine-based curing agent (modified dicyandiamide derivative) |
| Product Form | Free-flowing off-white to light tan crystalline powder |
| Appearance | Crystalline solid, homogeneous granular particles |
| Primary Applications | Epoxy resin systems for electronics encapsulation, composites, and electrical insulation |
| Key Features | Latent at room temperature; thermally activated; halogen-free; low volatility |
| Benefits | Extended shelf life, excellent storage stability, high Tg cured networks, low ionic contamination |
| Recommended Cure Schedule | 150–180 °C for 30–90 minutes (dependent on formulation and part geometry) |
| Handling Precautions | Use in well-ventilated areas; avoid inhalation of dust; refer to SDS for PPE guidance |
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