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Low-viscosity liquid formulation enabling excellent flow and wetting on complex substrates.
Room-temperature curing capability with balanced pot life and rapid development of mechanical strength.
High thermal stability and superior chemical resistance after full cure, especially to alkalis and solvents.
Low exotherm profile suitable for thick-section casting and sensitive electronic encapsulation.
Compatible with standard DGEBA-type epoxy resins without requiring catalysts or accelerators.
Electrical & electronics encapsulation and potting for transformers, sensors, and PCBs.
Structural adhesives for automotive and aerospace composite bonding.
High-performance flooring and industrial coating systems.
Wind turbine blade bonding and repair formulations.
Marine-grade protective coatings for hulls and offshore infrastructure.
| Chemical Type | Amine-based aliphatic polyamine adduct |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, low-viscosity liquid at 25°C |
| Density (25°C) | ~0.92–0.95 g/cm³ |
| Viscosity (25°C) | 250–450 mPa·s |
| Amine Value | 380–420 mg KOH/g |
| Reactivity Profile | Medium reactivity; gel time ~60–90 min at 25°C with DGEBA resin (1:1 ratio) |
| Storage Stability | 12 months in original sealed container at <25°C, protected from moisture |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
