English
Español
tiếng việt
русский
Highly latent at room temperature, enabling extended pot life and excellent storage stability.
Activates rapidly upon thermal triggering (typically >100 °C), ensuring efficient and controllable epoxy curing.
Delivers superior mechanical properties and thermal resistance in cured epoxy systems.
Low volatility and minimal odor, supporting safer handling and improved workplace hygiene.
Compatible with standard bisphenol-A and novolac epoxy resins without requiring co-catalysts.
Prepregs for aerospace and high-performance composites.
Electrical encapsulants and potting compounds for power electronics.
Structural adhesives requiring precise process control and long shelf life.
Coatings for metal substrates demanding high crosslink density and chemical resistance.
3D printing resins where thermal latency enables layer-by-layer deposition before final cure.
| Chemical Type | Modified imidazole derivative |
| Product Form | Powder |
| Appearance | Off-white to light tan free-flowing powder |
| Primary Applications | Epoxy resin curing agent for high-performance thermosets |
| Key Features | Latent, thermally activated, low volatility, resin-compatible |
| Recommended Storage | Below 25 °C, dry and dark conditions; stable for ≥12 months |
| Activation Temperature Range | 100–180 °C (cure onset ~100 °C) |
| Typical Loading Level | 3–8 phr (parts per hundred resin), depending on resin type and performance requirements |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
