English
Español
tiếng việt
русский
Low-viscosity, liquid amide-based curing agent enabling excellent processability and easy handling at ambient temperature.
Provides extended pot life with balanced reactivity for improved working time in manual and automated applications.
Delivers high-performance cured epoxy systems with superior flexibility, impact resistance, and low-temperature toughness.
Offers excellent adhesion to diverse substrates including metals, composites, and concrete without requiring surface priming.
Meets stringent regulatory requirements for industrial coatings and adhesive formulations, including REACH compliance.
Structural adhesives for automotive and aerospace assembly.
High-durability protective coatings for industrial flooring and tank linings.
Epoxy grouts and mortars used in civil engineering and infrastructure repair.
Composite matrix resins for wind turbine blades and pultruded profiles.
Electrical encapsulation and potting compounds requiring thermal stability and dielectric integrity.
| Chemical Type | Aliphatic polyamide |
| Product Form | Liquid |
| Appearance | Amber to light brown transparent liquid |
| Primary Applications | Adhesives, coatings, composites, grouts |
| Key Features | Low viscosity, ambient-cure capability, flexible cured film |
| Benefits | Improved work life, reduced mixing energy, enhanced toughness |
| Storage Stability | 12 months minimum when stored unopened at 15–25°C |
| REACH Status | Compliant (SVHC-free) |
Q1: What is the primary function of EPIKURE 3090 in epoxy formulations?
A: EPIKURE 3090 is a reactive amide-based curing agent designed to crosslink epoxy resins, delivering enhanced flexibility, impact resistance, and reduced brittleness compared to conventional amine hardeners—particularly beneficial in structural adhesives and high-performance coatings.
Q2: How does EPIKURE 3090 compare to traditional aliphatic amines in terms of pot life and reactivity?
A: EPIKURE 3090 offers significantly extended pot life at ambient temperatures while maintaining reliable cure development upon mild thermal activation—making it well-suited for applications requiring longer working time without sacrificing final mechanical performance.
Q3: Is EPIKURE 3090 compatible with standard DGEBA-type epoxy resins?
A: Yes, EPIKURE 3090 demonstrates broad compatibility with common liquid and solid bisphenol-A and bisphenol-F epoxy resins, as well as many modified epoxies—including novolac and cycloaliphatic systems—without requiring pre-treatment or special dispersion techniques.
Q4: What are typical handling and storage recommendations for this curing agent?
A: Store in tightly sealed containers under dry, cool conditions away from moisture, strong oxidizers, and direct sunlight. Due to its amide functionality, EPIKURE 3090 exhibits low volatility and minimal skin sensitization potential relative to primary amines—but standard industrial hygiene practices, including gloves and ventilation, should still be observed during handling.
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
