Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Zeneida SC-75LT Curing Agent

Zeneida SC-75LT is a low-temperature reactive curing agent from Zeneida’s SC series, engineered for epoxy resins requiring fast ambient-cure performance without ovens. It delivers excellent adhesion, chemical resistance, and mechanical strength at 5–25°C. Ideal for coatings, adhesives, and composites where energy efficiency and rapid throughput matter. Non-blushing, low-viscosity, and compatible with standard epoxy systems.
  • zeneida sc 75lt curing agent_f11e5ca5
  • zeneida sc 75lt curing agent_f11e5ca5

Features Of Zeneida SC-75LT Curing Agent

  1. Low-temperature curing capability down to –10 °C, enabling year-round application in cold climates.

  2. Extended pot life of 90–120 minutes at 23 °C, facilitating improved workability and large-area coating operations.

  3. Excellent chemical resistance to alkalis, solvents, and mild acids after full cure.

  4. Low viscosity (1,200–1,800 cP at 25 °C) ensures easy metering, mixing, and uniform dispersion with epoxy resins.

  5. Halogen-free formulation compliant with RoHS and REACH regulatory requirements.

Typical Applications Of Zeneida SC-75LT Curing Agent

  1. Cold-climate epoxy flooring systems for industrial warehouses and logistics centers.

  2. Structural adhesive formulations for precast concrete bonding and bridge deck repairs.

  3. High-performance protective coatings for marine infrastructure and offshore platforms.

  4. Electrical encapsulation and potting compounds requiring low-temperature processing.

  5. Wind turbine blade bonding adhesives where rapid green strength and sub-zero cure are critical.

Specifications Of Zeneida SC-75LT Curing Agent

Chemical TypeAliphatic polyamine adduct
Product FormLiquid
AppearancePale yellow to amber clear liquid
Primary ApplicationsEpoxy resin curing agent for coatings, adhesives, and composites
Key FeaturesLow-temperature cure, extended pot life, low viscosity, halogen-free
BenefitsReduced energy consumption, improved process flexibility, enhanced worker safety, broad compatibility with standard DGEBA resins
Density (25 °C)0.94–0.97 g/cm³
Reactivity ProfileMedium reactivity; compatible with accelerated heat-cure or ambient/low-temp cure cycles


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