Low-temperature curing capability down to –10 °C, enabling year-round application in cold climates.
Extended pot life of 90–120 minutes at 23 °C, facilitating improved workability and large-area coating operations.
Excellent chemical resistance to alkalis, solvents, and mild acids after full cure.
Low viscosity (1,200–1,800 cP at 25 °C) ensures easy metering, mixing, and uniform dispersion with epoxy resins.
Halogen-free formulation compliant with RoHS and REACH regulatory requirements.
Cold-climate epoxy flooring systems for industrial warehouses and logistics centers.
Structural adhesive formulations for precast concrete bonding and bridge deck repairs.
High-performance protective coatings for marine infrastructure and offshore platforms.
Electrical encapsulation and potting compounds requiring low-temperature processing.
Wind turbine blade bonding adhesives where rapid green strength and sub-zero cure are critical.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Primary Applications | Epoxy resin curing agent for coatings, adhesives, and composites |
| Key Features | Low-temperature cure, extended pot life, low viscosity, halogen-free |
| Benefits | Reduced energy consumption, improved process flexibility, enhanced worker safety, broad compatibility with standard DGEBA resins |
| Density (25 °C) | 0.94–0.97 g/cm³ |
| Reactivity Profile | Medium reactivity; compatible with accelerated heat-cure or ambient/low-temp cure cycles |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China