Highly reactive aliphatic amine-based curing agent for rapid room-temperature cure of epoxy resins.
Low viscosity and excellent compatibility with standard bisphenol-A and bisphenol-F epoxy systems.
Superior chemical resistance and thermal stability in cured epoxy networks.
Low volatility and low skin sensitization potential—designed for improved occupational safety.
Consistent batch-to-batch performance supported by Tosoh’s stringent quality control protocols.
Electrical encapsulation and potting compounds for power electronics and EV components.
Structural adhesives in aerospace composite bonding and automotive lightweight assemblies.
High-performance coatings for industrial flooring and corrosion-resistant tank linings.
Wind turbine blade bonding and repair formulations requiring fast turnaround and low-temperature cure.
3D printing support materials and high-resolution stereolithography (SLA) resin modifiers.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Viscosity (25°C) | 300–600 mPa·s |
| Density (25°C) | 0.94–0.97 g/cm³ |
| Amine Value | 380–420 mg KOH/g |
| Reactivity Profile | Room-temperature curable; full cure achievable within 24–48 h at 23°C |
| Storage Stability | 12 months in unopened original container at 15–25°C |
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E-mail: wangxingqiang@ericwchem.com
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