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Low-viscosity liquid enabling easy handling and homogeneous mixing with epoxy resins.
Fast room-temperature cure kinetics without requiring elevated post-cure temperatures.
Excellent chemical resistance, particularly to hydrocarbons and industrial solvents.
High glass transition temperature (Tg) achieved in cured epoxy systems for structural integrity.
Reduced volatility and improved occupational safety profile compared to conventional aromatic amines.
Structural adhesives for aerospace and transportation bonding applications.
High-performance composite matrices in wind turbine blade manufacturing.
Industrial flooring and grouting systems requiring rapid turnaround and chemical durability.
Electrical potting and encapsulation compounds demanding thermal stability and dielectric performance.
Repair mortars and protective coatings for offshore and marine infrastructure.
| Chemical Type | Modified aromatic amine |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Primary Applications | Epoxy resin curing agent for high-performance composites and adhesives |
| Key Features | Room-temperature cure, low viscosity, high Tg, chemical resistance |
| Benefits | Improved process efficiency, reduced energy consumption, enhanced mechanical properties |
| Storage Stability | 12 months minimum at 25°C in unopened original containers |
| Compatibility | Compatible with standard bisphenol-A and bisphenol-F epoxy resins |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
