Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Chang Chun Fujicure FXR-1020 Epoxy Latent Hardener

ChangChunFujicureFXR-1020isalatentepoxyhardenerfromChangChun’sFujicure®series,designedforone-partformulationsrequiringlongshelflifeandrapidcureuponheating.Keyfeaturesincludeexcellentstoragestability,lowvolatility,highreactivityatabove150°C,andcompatibilitywithstandardbisphenol-Aepoxies.
  • chang chun fujicure fxr 1020 epoxy latent hardener_2e6b9486
  • chang chun fujicure fxr 1020 epoxy latent hardener_2e6b9486

Features Of Chang Chun Fujicure FXR-1020 Epoxy Latent Hardener

  1. Highly latent at room temperature, enabling extended pot life and ambient storage stability.

  2. Activates rapidly upon thermal curing (typically 130–160 °C), delivering efficient crosslinking with standard epoxy resins.

  3. Halogen-free formulation, supporting compliance with RoHS and REACH regulatory requirements.

  4. Excellent compatibility with bisphenol-A and bisphenol-F epoxy resins, ensuring homogeneous dispersion and minimal phase separation.

  5. Yields cured systems with high glass transition temperature (Tg) and superior mechanical strength.

Typical Applications Of Chang Chun Fujicure FXR-1020 Epoxy Latent Hardener

  1. Electronics encapsulation and underfill materials for IC packaging and semiconductor assembly.

  2. Powder coatings requiring low-bake performance and excellent edge coverage.

  3. Prepregs and laminates in printed circuit board (PCB) manufacturing.

  4. Structural adhesives for automotive and aerospace composite bonding.

  5. High-performance casting and potting compounds for electrical insulation.

Specifications Of Chang Chun Fujicure FXR-1020 Epoxy Latent Hardener

Chemical TypeDicyandiamide-based latent hardener
Product FormFine white crystalline powder
AppearanceWhite to off-white free-flowing powder
Primary ApplicationsEpoxy resin systems for electronics, composites, and coatings
Key FeaturesLatent, halogen-free, thermally activated, high Tg capability
Recommended Cure Schedule150 °C for 30–60 minutes (varies by resin system)
Storage ConditionsSealed container at ≤25 °C, dry environment; stable for ≥12 months
Handling PrecautionsUse in well-ventilated areas; avoid inhalation of dust and skin contact


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