Highly latent at room temperature, enabling extended pot life and ambient storage stability.
Activates rapidly upon thermal curing (typically 130–160 °C), delivering efficient crosslinking with standard epoxy resins.
Halogen-free formulation, supporting compliance with RoHS and REACH regulatory requirements.
Excellent compatibility with bisphenol-A and bisphenol-F epoxy resins, ensuring homogeneous dispersion and minimal phase separation.
Yields cured systems with high glass transition temperature (Tg) and superior mechanical strength.
Electronics encapsulation and underfill materials for IC packaging and semiconductor assembly.
Powder coatings requiring low-bake performance and excellent edge coverage.
Prepregs and laminates in printed circuit board (PCB) manufacturing.
Structural adhesives for automotive and aerospace composite bonding.
High-performance casting and potting compounds for electrical insulation.
| Chemical Type | Dicyandiamide-based latent hardener |
| Product Form | Fine white crystalline powder |
| Appearance | White to off-white free-flowing powder |
| Primary Applications | Epoxy resin systems for electronics, composites, and coatings |
| Key Features | Latent, halogen-free, thermally activated, high Tg capability |
| Recommended Cure Schedule | 150 °C for 30–60 minutes (varies by resin system) |
| Storage Conditions | Sealed container at ≤25 °C, dry environment; stable for ≥12 months |
| Handling Precautions | Use in well-ventilated areas; avoid inhalation of dust and skin contact |
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E-mail: wangxingqiang@ericwchem.com
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