Low-viscosity liquid formulation enables easy handling and uniform mixing with epoxy resins.
Room-temperature curing capability with rapid gelation and full cure within 24–48 hours.
Excellent chemical resistance to alkalis, solvents, and mild acids after full cure.
Low exotherm profile minimizes internal stress and reduces risk of cracking in thick-section castings.
Halogen-free composition supports compliance with RoHS and REACH regulatory requirements.
Electrical potting and encapsulation for transformers, sensors, and PCB modules.
Structural adhesives in automotive composite bonding and lightweight assembly.
High-performance flooring and grouting systems for industrial facilities.
Wind turbine blade bonding and repair formulations requiring low-temperature operability.
Marine coatings and corrosion-resistant linings for offshore infrastructure.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, free from sediment or haze |
| Viscosity (25°C) | 350–550 mPa·s |
| Density (25°C) | 0.96–0.99 g/cm³ |
| Amine Value | 280–320 mg KOH/g |
| Primary Applications | Epoxy resin curing for electrical, structural, and protective applications |
| Key Features | Room-temperature cure, low exotherm, halogen-free, solvent-free |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China