Low-viscosity liquid formulation enables easy handling and uniform mixing with epoxy resins.
Room-temperature curing capability reduces energy consumption and simplifies processing.
Excellent chemical resistance to alkalis, solvents, and mild acids after full cure.
Low exotherm profile minimizes internal stress and improves dimensional stability of castings.
Halogen-free composition supports compliance with RoHS and REACH regulatory requirements.
Electrical potting and encapsulation for transformers, sensors, and power modules.
High-voltage insulating coatings for busbars and switchgear components.
Structural adhesives in composite bonding for wind turbine blade assembly.
Casting compounds for LED housings and optical-grade electronic enclosures.
Repair mortars and grouts in industrial flooring and concrete rehabilitation systems.
| Chemical Type | Amine-modified aliphatic polyamine |
| Product Form | Clear to pale yellow low-viscosity liquid |
| Appearance | Homogeneous, free from visible particles or gels |
| Density (25°C) | 0.92–0.94 g/cm³ |
| Viscosity (25°C) | 180–220 mPa·s |
| Amine Value | 380–410 mg KOH/g |
| Primary Applications | Epoxy resin curing for electrical insulation and structural bonding |
| Key Features | Room-temperature cure, low exotherm, halogen-free, good moisture tolerance |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China