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Latent at room temperature — enables extended pot life and ambient storage stability.
Activates rapidly upon heating — delivers efficient epoxy resin cure onset above 100 °C.
Halogen-free formulation — supports compliance with RoHS, REACH, and low-halogen electronics standards.
Low volatility and minimal odor — enhances workplace safety and reduces VOC emissions during processing.
Excellent compatibility with standard bisphenol-A and novolac epoxy resins — simplifies formulation integration.
High-reliability encapsulants for semiconductor packaging and power modules.
Prepregs and laminates in printed circuit board (PCB) manufacturing.
Structural adhesives for aerospace composite bonding.
Electrical insulation systems in motors, transformers, and high-voltage equipment.
Thermal interface materials requiring precise thermal-triggered crosslinking.
| Chemical Type | Imidazole derivative |
| Product Form | Off-white to light tan crystalline powder |
| Appearance | Free-flowing crystalline solid |
| Primary Applications | Epoxy resin curing in electronics and composites |
| Key Features | Latent, thermally activated, halogen-free |
| Onset Cure Temperature | ≥ 100 °C (DSC, 10 °C/min) |
| Storage Stability | Stable ≥ 12 months at 25 °C in sealed container |
| Recommended Loading Range | 0.5–2.0 phr (parts per hundred resin) |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
