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Low-VOC, water-based formulation compliant with global environmental regulations including REACH and VOC directives.
Excellent compatibility with standard waterborne epoxy resins, enabling stable emulsion formation and extended pot life.
Fast ambient-cure capability with good early hardness development and low-temperature curing performance down to 5°C.
Superior adhesion to diverse substrates including concrete, steel, and galvanized metal without primer requirement.
Non-yellowing, alkali-resistant cured film ideal for interior architectural and protective coating applications.
Waterborne epoxy floor coatings for industrial facilities and cleanrooms.
Concrete primers and moisture-tolerant undercoats for infrastructure rehabilitation.
Corrosion-resistant coatings for mild steel in non-submerged above-ground environments.
Interior wall and ceiling coatings in healthcare, education, and commercial buildings.
Hybrid binder systems for high-performance waterborne epoxy-polyurethane topcoats.
| Chemical Type | Polyamidoamine adduct, water-dispersible |
| Product Form | Opaque white liquid |
| Appearance | Homogeneous milky dispersion, no sedimentation |
| pH (10% aqueous solution) | 8.2 – 8.8 |
| Solids Content (wt%) | 52 ± 2% |
| Density (25°C, g/cm³) | 1.03 – 1.07 |
| Viscosity (Brookfield, RVT, #3 spindle, 25°C) | 800 – 1,400 cP |
| Free Amine Value (mg KOH/g) | 210 – 240 |
Q1: What types of waterborne epoxy resins is YPWEC-0160 compatible with?
A: YPWEC-0160 is specifically formulated for use with standard anionic and non-ionic waterborne epoxy dispersions, including bisphenol-A and bisphenol-F based systems. Compatibility should be verified experimentally in the final formulation due to variations in resin particle size, ionic stabilization, and pH.
Q2: How does YPWEC-0160 affect pot life and film formation in waterborne epoxy coatings?
A: As a low-VOC, amine-functional curing agent, YPWEC-0160 provides extended working time at ambient temperatures while enabling efficient crosslinking upon water evaporation and coalescence. Film formation is supported by its balanced hydrophilicity–hydrophobicity profile, contributing to uniform cure development without excessive surface tackiness.
Q3: Can YPWEC-0160 be used in high-solids or low-water-content formulations?
A: Yes — YPWEC-0160 exhibits good stability and reactivity in reduced-water systems, including high-solids waterborne epoxy blends. Its molecular design supports compatibility with common co-solvents (e.g., glycol ethers) and allows formulators flexibility in adjusting water content without compromising storage stability or cure performance.
Q4: Is YPWEC-0160 suitable for applications requiring FDA-compliant or food-contact-safe cured films?
A: YPWEC-0160 is not pre-certified for direct food contact. While it is designed to minimize volatile amines and support low-migration cured networks, regulatory compliance depends on the full formulation, cure conditions, and end-use requirements. Customers must conduct appropriate migration testing and consult relevant regulatory authorities for intended applications.
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
