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High-purity dicyandiamide formulation optimized for consistent epoxy resin curing performance.
Enhanced thermal stability enabling reliable processing at elevated temperatures without premature decomposition.
Low volatility and excellent storage stability under ambient conditions, minimizing handling risks.
Controlled reactivity profile allowing extended pot life and precise gel time management in industrial formulations.
Free-flowing powder with uniform particle size distribution for improved dispersion in epoxy systems.
Electrical insulation materials for high-voltage equipment and transformers.
Structural adhesives requiring high glass transition temperature (Tg) and dimensional stability.
Encapsulants and potting compounds used in automotive electronics and power modules.
Prepregs and laminates for printed circuit board (PCB) substrates demanding flame retardancy and low ionic impurities.
Composite matrices for aerospace and wind energy components requiring long-term thermo-oxidative resistance.
| Chemical Type | Dicyandiamide (DICY) |
| Product Form | Fine white crystalline powder |
| Appearance | White to off-white free-flowing powder |
| Purity (by HPLC) | ≥ 99.5 % |
| Moisture Content | ≤ 0.2 % (w/w) |
| Particle Size (d₅₀) | Approx. 15–25 µm |
| pH (1% aqueous suspension) | 6.5–7.5 |
| Primary Applications | Epoxy resin curing agent for high-performance composites and electrical applications |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
