High reactivity with epoxy resins, enabling rapid gelation and reduced cycle times.
Excellent chemical resistance post-cure, particularly to solvents, acids, and alkalis.
Low viscosity for easy handling, metering, and homogeneous mixing without solvent addition.
Good thermal stability with glass transition temperature (Tg) exceeding 120 °C in cured systems.
Halogen-free formulation compliant with RoHS and REACH regulatory requirements.
Structural adhesives for aerospace composite bonding and metal-to-composite assemblies.
High-performance encapsulants and potting compounds in power electronics and EV battery modules.
Wind turbine blade root joint and shear web adhesives requiring long-term durability under cyclic loading.
Prepreg resin systems for carbon fiber reinforced polymer (CFRP) laminates in automotive lightweighting.
Electrical insulation coatings and busbar encapsulation in high-voltage infrastructure.
| Chemical Type | Amine-functional polyetheramine |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Primary Applications | Epoxy resin curing agent for structural composites and electronics |
| Key Features | Rapid cure, low exotherm, halogen-free, solvent-free |
| Benefits | Improved production efficiency, enhanced long-term reliability, reduced VOC emissions |
| Density (25 °C) | 1.02–1.05 g/cm³ |
| Viscosity (25 °C) | 350–550 mPa·s |
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E-mail: wangxingqiang@ericwchem.com
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