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DX-75P Curing Agent is a high-performance aliphatic amine-based hardener from Dongxin Chemical’s DX Series, engineered for rapid curing of epoxy resins under ambient conditions. It delivers excellent flexibility, chemical resistance, and low viscosity—ideal for coatings, adhesives, and composites requiring fast turnaround and robust mechanical properties.
High reactivity with epoxy resins, enabling rapid gelation and reduced cycle times.
Excellent chemical resistance post-cure, particularly to solvents, acids, and alkalis.
Low viscosity for easy handling, metering, and homogeneous mixing without solvent addition.
Good thermal stability with glass transition temperature (Tg) exceeding 120 °C in cured systems.
Halogen-free formulation compliant with RoHS and REACH regulatory requirements.
Structural adhesives for aerospace composite bonding and metal-to-composite assemblies.
High-performance encapsulants and potting compounds in power electronics and EV battery modules.
Wind turbine blade root joint and shear web adhesives requiring long-term durability under cyclic loading.
Prepreg resin systems for carbon fiber reinforced polymer (CFRP) laminates in automotive lightweighting.
Electrical insulation coatings and busbar encapsulation in high-voltage infrastructure.
| Chemical Type | Amine-functional polyetheramine |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Primary Applications | Epoxy resin curing agent for structural composites and electronics |
| Key Features | Rapid cure, low exotherm, halogen-free, solvent-free |
| Benefits | Improved production efficiency, enhanced long-term reliability, reduced VOC emissions |
| Density (25 °C) | 1.02–1.05 g/cm³ |
| Viscosity (25 °C) | 350–550 mPa·s |
Q1: What types of resins is DX-75P Curing Agent compatible with?
A: DX-75P is specifically formulated for use with epoxy resins, including both liquid and solid bisphenol-A and bisphenol-F types. It demonstrates good reactivity and compatibility in solvent-based, high-solids, and solvent-free epoxy systems.
Q2: How does temperature affect the curing performance of DX-75P?
A: DX-75P exhibits moderate thermal sensitivity — it enables practical pot life at ambient temperatures while supporting efficient post-cure development at elevated temperatures (typically 80–120 °C). Lower ambient temperatures may extend gel time, whereas higher temperatures accelerate crosslinking and final hardness development.
Q3: Is DX-75P suitable for applications requiring low VOC emissions?
A: Yes — DX-75P is a non-volatile, low-odor curing agent with negligible VOC contribution. It supports formulators aiming to meet stringent industrial air quality guidelines and sustainability targets without compromising cure efficiency or film integrity.
Q4: What handling precautions should be observed when working with DX-75P?
A: As with most amine-based curing agents, DX-75P may cause skin and eye irritation. Users should wear appropriate personal protective equipment (PPE), including nitrile gloves, safety goggles, and respiratory protection if aerosols or mists are generated during high-shear mixing. Good ventilation is recommended during handling and processing.
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E-mail: wangxingqiang@ericwchem.com
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