Fast-reacting aliphatic amine-based curing agent for room-temperature and elevated-temperature epoxy systems.
Excellent chemical resistance to acids, alkalis, and solvents after full cure.
Low viscosity (200–300 mPa·s at 25°C) enabling easy metering, mixing, and deep-section penetration.
Low volatility and negligible odor — supports safer handling and improved workplace compliance.
Provides high glass transition temperature (Tg > 100°C) and superior mechanical strength in cured epoxy networks.
Structural adhesives for aerospace composite bonding and metal-to-composite joining.
High-performance protective coatings for industrial flooring and chemical containment linings.
Electrical encapsulants and potting compounds for power electronics and EV battery modules.
Wind turbine blade adhesive systems requiring rapid fixture and long-term environmental stability.
Tooling resins and casting compounds for precision molds and prototype manufacturing.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Density (25°C) | 0.92–0.95 g/cm³ |
| Viscosity (25°C) | 200–300 mPa·s |
| Amine Value | 380–420 mg KOH/g |
| Primary Applications | Epoxy resin curing for structural adhesives, coatings, and encapsulants |
| Key Features | Room-temperature curable, low exotherm, high Tg, excellent adhesion to metals and composites |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China