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Fast-reacting aliphatic amine-based curing agent for room-temperature and elevated-temperature epoxy systems.
Low viscosity (< 300 cP at 25°C) ensures excellent mixing efficiency and reduced entrapped air in formulated resins.
Superior chemical resistance post-cure, especially to alkalis, solvents, and mild acids.
Low volatility and non-skin-sensitizing formulation—meets current occupational health and safety guidelines for handling.
Enables high glass transition temperature (Tg > 110°C) in cured epoxy networks without post-bake.
Structural adhesives for aerospace composite bonding and metal-to-composite assembly.
High-performance protective coatings for offshore platforms and chemical processing equipment.
Electrical encapsulants and potting compounds requiring thermal stability and dielectric integrity.
Wind turbine blade root joint adhesives and shear web bonding systems.
Repair mortars and grouts for industrial concrete rehabilitation under ambient conditions.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow clear liquid |
| Specific Gravity (25°C) | 0.94–0.96 g/cm³ |
| Amine Value | 380–420 mg KOH/g |
| Viscosity (25°C) | 220–280 cP |
| Reactivity with DGEBA Epoxy | Gel time: 25–35 min at 25°C (100:35 w/w) |
| Storage Stability | ≥12 months in sealed container at <30°C |
Q1: What types of resins is HDX-50B Curing Agent compatible with?
A: HDX-50B is specifically formulated for use with epoxy resins, including bisphenol-A and bisphenol-F based systems. It demonstrates good reactivity and compatibility with standard liquid and solid epoxy grades commonly employed in industrial coatings, adhesives, and composite applications.
Q2: How does HDX-50B affect pot life and cure speed compared to conventional amine curing agents?
A: HDX-50B offers a balanced reactivity profile—providing extended working time at ambient temperatures while enabling efficient post-cure development. Its latency allows for improved formulation handling versus highly reactive aliphatic amines, without the extreme dormancy of some dicyandiamide-based systems.
Q3: Is HDX-50B suitable for low-VOC or solvent-free formulations?
A: Yes—HDX-50B is a low-volatility, non-solvent-based solid curing agent. It supports the development of high-solids and 100% solids epoxy systems, aligning well with modern environmental and regulatory expectations for reduced emissions.
Q4: What is the recommended dosage range for HDX-50B in epoxy formulations?
A: Dosage depends on the epoxy equivalent weight and desired performance profile, but HDX-50B is typically used at low concentrations—generally ranging from 0.1% to 2% by weight relative to the epoxy resin. Optimization through small-scale trials is recommended for each specific system.
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