Fast-reacting aliphatic amine-based curing agent for room-temperature and elevated-temperature epoxy systems.
Low viscosity (< 300 cP at 25°C) ensures excellent mixing efficiency and reduced entrapped air in formulated resins.
Superior chemical resistance post-cure, especially to alkalis, solvents, and mild acids.
Low volatility and non-skin-sensitizing formulation—meets current occupational health and safety guidelines for handling.
Enables high glass transition temperature (Tg > 110°C) in cured epoxy networks without post-bake.
Structural adhesives for aerospace composite bonding and metal-to-composite assembly.
High-performance protective coatings for offshore platforms and chemical processing equipment.
Electrical encapsulants and potting compounds requiring thermal stability and dielectric integrity.
Wind turbine blade root joint adhesives and shear web bonding systems.
Repair mortars and grouts for industrial concrete rehabilitation under ambient conditions.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow clear liquid |
| Specific Gravity (25°C) | 0.94–0.96 g/cm³ |
| Amine Value | 380–420 mg KOH/g |
| Viscosity (25°C) | 220–280 cP |
| Reactivity with DGEBA Epoxy | Gel time: 25–35 min at 25°C (100:35 w/w) |
| Storage Stability | ≥12 months in sealed container at <30°C |
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