Fast-reacting aliphatic amine-based curing agent for ambient and elevated temperature cure profiles.
Excellent compatibility with standard epoxy resins, enabling uniform crosslinking without phase separation.
Low viscosity (200–300 mPa·s at 25°C) ensures easy metering, mixing, and improved wetting of fillers and reinforcements.
Low volatility and negligible vapor pressure enhance workplace safety and reduce VOC emissions during processing.
Delivers high glass transition temperature (Tg > 120°C) and superior chemical resistance in cured epoxy systems.
Structural adhesives for aerospace composite bonding and metal-to-composite joining.
High-performance electrical encapsulants and potting compounds for power electronics and EV battery modules.
Wind turbine blade adhesive systems requiring rapid green strength and long-term durability under cyclic loading.
Industrial flooring and protective coatings where rapid return-to-service and abrasion resistance are critical.
Prepreg tackifiers and resin infusion matrices for carbon fiber reinforced polymer (CFRP) manufacturing.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Density (25°C) | 0.92–0.95 g/cm³ |
| Viscosity (25°C) | 200–300 mPa·s |
| Amine Value | 380–420 mg KOH/g |
| Primary Applications | Epoxy resin curing for structural composites, adhesives, and encapsulants |
| Key Features | Ambient-cure capable, low blush tendency, hydrolytic stability |
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E-mail: wangxingqiang@ericwchem.com
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