High reactivity with epoxy resins, enabling rapid gelation and reduced cycle times.
Excellent low-temperature curing capability down to 5°C without compromising final mechanical properties.
Low viscosity (800–1,200 cP at 25°C) for easy handling, metering, and homogeneous mixing.
Superior chemical resistance in cured systems, particularly against alkalis and mild acids.
Non-chlorinated, halogen-free formulation supporting RoHS and REACH compliance.
Electrical potting and encapsulation of transformers, sensors, and PCB modules.
Structural adhesives for aerospace composite bonding and automotive lightweight assemblies.
High-performance flooring and protective coatings for industrial concrete substrates.
Wind turbine blade bonding and root-end filling in renewable energy manufacturing.
Tooling and mold-making compounds requiring dimensional stability and thermal resilience.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow, clear liquid |
| Primary Applications | Epoxy resin curing for structural adhesives, potting, and coatings |
| Key Features | Low-temperature cure, low viscosity, halogen-free |
| Benefits | Improved process efficiency, enhanced safety profile, broad compatibility with standard DGEBA resins |
| Density (25°C) | 0.94–0.97 g/cm³ |
| Shelf Life (unopened, 20°C) | 12 months |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China