Low-viscosity liquid formulation enables excellent mixing and processing with epoxy resins.
Fast ambient-cure capability without requiring elevated temperature post-curing.
Superior chemical resistance, especially to alkalis and mild solvents after full cure.
Low exotherm profile ensures reduced internal stress and minimized warpage in thick-section castings.
Halogen-free composition compliant with RoHS and REACH regulatory requirements.
Electrical potting and encapsulation for transformers, sensors, and PCB modules.
High-voltage insulating coatings and busbar protection systems.
Structural adhesives in wind energy components and rail interior assemblies.
Repair compounds for corrosion-resistant linings in chemical process equipment.
UV/LED-assisted hybrid curing systems for rapid prototyping and precision tooling.
| Chemical Type | Aliphatic amine adduct |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, low-viscosity liquid, free of sediment |
| Primary Applications | Epoxy resin curing for electrical insulation and structural bonding |
| Key Features | Ambient-curing, low exotherm, halogen-free, good hydrolytic stability |
| Benefits | Improved operator safety, extended working life, enhanced long-term dielectric performance |
| Storage Conditions | Keep tightly sealed under dry nitrogen; store at 10–25°C |
| Shelf Life | 12 months from date of manufacture when stored properly |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China