Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Kukdo Chemical KD-213F2 Epoxy Resin

Kukdo KD-213F2 is a fast-curing low-temperature solid bisphenol A epoxy resin in KD series, designed for low-temperature fast-curing powder coatings in high-efficiency coating scenarios. It is off-white particles, fast curing at 130℃ for 10min, no film performance attenuation, suitable for high-beat production lines, ideal for industrial high-efficiency coating.

Features Of Kukdo Chemical KD-213F2 Epoxy Resin

  • Ultra-fast low-temperature curing - Complete curing at 130℃ in only 10 minutes, curing efficiency increased by 60% compared with conventional products

  • Wide curing window adaptation - Stable curing in 130℃~160℃ range, suitable for coating lines with different temperature control precision

  • Excellent post-curing performance - Low-temperature curing still maintains 0-grade adhesion and salt spray resistance ≥1000h without performance loss

  • High leveling film formation - Excellent leveling property at low temperature, no orange peel or pinhole defects on film surface

  • Energy-saving and cost-reducing advantages - Low-temperature curing can reduce equipment energy consumption by ≥30%, suitable for high-beat mass production

Typical Applications Of Kukdo Chemical KD-213F2 Epoxy Resin

  • Home appliance hardware coating - High-beat low-temperature fast-curing coating for refrigerator/washing machine hardware

  • Auto parts - High-efficiency low-temperature protective coating for automotive interior metal parts and buckles

  • Office furniture accessories - Fast-curing coating for office chair metal frames and filing cabinet accessories

  • Hardware tool coating - Batch high-efficiency low-temperature curing coating for hand tools and hardware accessories

  • Building material hardware coatings - High-capacity fast protective coating for door/window hardware and guardrail accessories

Specifications Of Kukdo Chemical KD-213F2 Epoxy Resin

Chemical CategoryModified Bisphenol A Epoxy Resin
Epoxy Equivalent (g/mol)200-230
Softening Point (℃)65-75
Melt Viscosity (130℃, mPa·s)22-35
Curing Time (130℃, min)10
Curing Time (150℃, min)6
Volatile Content (%)≤0.3
Adhesion (Grade)0
Salt Spray Resistance (h)≥1000 (Neutral Salt Spray)
Pencil Hardness≥2H


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