SM-684 is a premium modified epoxy resin in Kukdo’s SM series, designed for precision component encapsulation and high-performance structural bonding. It features excellent low-shrinkage curing and strong substrate adhesion, deeply penetrating micro-pores to form a dense bonding layer.
High-adhesion formula - Firmly bonds to metal, plastic, PCB and other substrates
All-liquid active system - 100% active ingredients, solvent-free and eco-friendly, ready for use
Excellent thermal shock resistance - Withstands severe thermal shock after curing, stable performance at high temperatures
Low-shrinkage curing - Low curing shrinkage, reducing component stress damage
Superior electrical properties - Excellent insulation, ensuring safe operation of electronic components
Electronic component packaging - Potting protection for transistors, semiconductor components and inductance coils
Precision electronic bonding - Fixing of PCB electronic components and bonding protection of IC chips
Electrical component sealing - Sealing and moisture-proofing for relays, capacitors, triggers and other components
Automotive electronic components - Bonding and protective packaging of automotive electronic components
Motor component fixing - Positioning and structural bonding of internal motor components
| Appearance | Light Yellow Transparent Liquid |
| Epoxy Equivalent (g/eq) | 230-250 |
| Viscosity (25℃, cps) | 3800-5800 |
| Color (G) | ≤8 |
| Hydrolyzable Chlorine (ppm) | ≤300 |
| Solid Content (%) | 100 |
| Density (20℃, g/cm³) | 1.16-1.18 |
| Glass Transition Temperature (Tg, ℃) | 110-120 |
| Adhesion (Tensile Strength, MPa) | ≥5 |
| Volume Resistivity (Ω·cm) | ≥1.0×10¹⁴ |
| Temperature Range (℃) | -55~150 |
| Curing Shrinkage (%) | ≤2.0 |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China