High-performance liquid bisphenol-A epoxy resin with low viscosity for excellent processability.
Consistent molecular weight distribution ensuring reliable reactivity and cure profile.
Superior adhesion to metals, composites, and engineered substrates.
Excellent electrical insulation properties and dielectric strength.
Compatible with standard amine, anhydride, and catalytic curing agents.
Electrical encapsulation and potting of transformers, sensors, and power modules.
Structural adhesives for aerospace and automotive composite bonding.
Matrix resin in filament-wound pressure vessels and piping systems.
High-voltage insulators and bushings requiring thermal stability and tracking resistance.
Prepregs and infusion resins for wind turbine blade manufacturing.
| Chemical Type | Liquid Bisphenol-A Epoxy Resin |
| Product Form | Clear to pale yellow viscous liquid |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity at 25°C | 12,000–16,000 cP |
| Chloride Content | ≤ 500 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at 20–25°C in original unopened container |
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E-mail: wangxingqiang@ericwchem.com
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