High purity bisphenol A-based epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low volatile organic compound (VOC) content.
Optimized reactivity for balanced pot life and rapid cure with standard amine or anhydride hardeners.
Superior adhesion to metals, composites, and cured polymer substrates.
Low moisture absorption and high electrical insulation performance after curing.
Structural adhesives for aerospace and automotive bonding.
Electrical encapsulation and potting compounds for power electronics.
High-performance composite matrices in wind turbine blades and sporting goods.
Coating systems for corrosion protection of offshore and industrial steel structures.
Prepregs and filament-wound components requiring dimensional stability and toughness.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels and suspended matter |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–16,000 mPa·s |
| Softening Point | 12–15°C |
| Chloride Content | ≤ 1,000 ppm |
| Volatiles Content | ≤ 0.3 wt% |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China