Low-viscosity liquid formulation enables easy handling and uniform mixing with epoxy resins.
Room-temperature curing capability reduces energy consumption and simplifies production workflows.
Excellent chemical resistance, particularly to alkalis, solvents, and mild acids after full cure.
Low exotherm profile minimizes internal stress and improves dimensional stability in thick-section castings.
Halogen-free composition supports compliance with RoHS and REACH regulatory requirements.
Electrical potting and encapsulation for transformers, sensors, and power modules.
High-performance adhesive systems in automotive electronics and EV battery assembly.
Protective coatings for concrete flooring in pharmaceutical and food-processing facilities.
Structural composites requiring low shrinkage and high glass transition temperature (Tg).
Repair mortars and grouts for industrial machinery and precision equipment foundations.
| Chemical Type | Aliphatic amine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow, clear, homogeneous liquid |
| Density (25°C) | 0.94–0.96 g/cm³ |
| Viscosity (25°C) | 350–500 mPa·s |
| Amine Value | 280–310 mg KOH/g |
| Primary Applications | Epoxy resin curing agent for structural adhesives, potting compounds, and protective coatings |
| Key Features | Room-temperature cure, low exotherm, halogen-free, good compatibility with standard DGEBA resins |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China