SM-688 is a premium low-viscosity modified epoxy resin in Kukdo’s SM series, designed for electronic component encapsulation and precision casting. It features excellent flow wettability and low-shrinkage curing, adapting to fine-structure filling and molding.
Low-viscosity flow system - Excellent fluidity, easy to fill fine gaps with no bubble residue
All-liquid active formula - 100% active ingredients, ready for use without dilution
Low-shrinkage curing - Low curing shrinkage, high dimensional accuracy, stable molding
Excellent bonding and sealing - Firmly bonds to metal, ceramic and other substrates, strong sealing protection
Good temperature resistance - Stable performance in wide temperature range, enduring electronic component working temperature rise
Electronic component encapsulation - Potting protection for small sensors, precision resistors and capacitors
Precision casting - Epoxy resin casting for fine molds and small structural parts
Electronic module sealing - Waterproof sealing for automotive electronic modules and microcontrollers
Optical fiber device encapsulation - Encapsulation and fixing of fiber optic connectors and small optoelectronic devices
Precision adhesives - Structural bonding for electronic component pins and micro-components
| Appearance | Colorless Transparent Liquid |
| Type | Low-Viscosity Modified Bisphenol A Epoxy Resin |
| Epoxy Equivalent (g/eq) | 210-230 |
| Viscosity (25℃, cps) | 1500-2500 |
| Solid Content (%) | 100 |
| Density (20℃, g/cm³) | 1.12-1.14 |
| Glass Transition Temperature (Tg, ℃) | 100-110 |
| Curing Shrinkage (%) | ≤0.3 |
| Hydrolyzable Chlorine (ppm) | ≤200 |
| Color (APHA) | ≤50 |
| Temperature Resistance Range (℃) | -40~120 |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China