Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Kukdo Chemical SM-688 Epoxy Resin

SM-688 is a premium low-viscosity modified epoxy resin in Kukdo’s SM series, designed for electronic component encapsulation and precision casting. It features excellent flow wettability and low-shrinkage curing, adapting to fine-structure filling and molding.

Features Of Kukdo Chemical SM-688 Epoxy Resin

  • Low-viscosity flow system - Excellent fluidity, easy to fill fine gaps with no bubble residue

  • All-liquid active formula - 100% active ingredients, ready for use without dilution

  • Low-shrinkage curing - Low curing shrinkage, high dimensional accuracy, stable molding

  • Excellent bonding and sealing - Firmly bonds to metal, ceramic and other substrates, strong sealing protection

  • Good temperature resistance - Stable performance in wide temperature range, enduring electronic component working temperature rise

Typical Applications Of Kukdo Chemical SM-688 Epoxy Resin

  • Electronic component encapsulation - Potting protection for small sensors, precision resistors and capacitors

  • Precision casting - Epoxy resin casting for fine molds and small structural parts

  • Electronic module sealing - Waterproof sealing for automotive electronic modules and microcontrollers

  • Optical fiber device encapsulation - Encapsulation and fixing of fiber optic connectors and small optoelectronic devices

  • Precision adhesives - Structural bonding for electronic component pins and micro-components

Specifications Of Kukdo Chemical SM-688 Epoxy Resin

AppearanceColorless Transparent Liquid
TypeLow-Viscosity Modified Bisphenol A Epoxy Resin
Epoxy Equivalent (g/eq)210-230
Viscosity (25℃, cps)1500-2500
Solid Content (%)100
Density (20℃, g/cm³)1.12-1.14
Glass Transition Temperature (Tg, ℃)100-110
Curing Shrinkage (%)≤0.3
Hydrolyzable Chlorine (ppm)≤200
Color (APHA)≤50
Temperature Resistance Range (℃)-40~120


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