Kukdo SMB-450A-80 is a premium high-solid solvent-based brominated epoxy resin, designed for high-end CCL and PCB. It features 80% solid content, intrinsic flame retardancy, excellent adhesion and high Tg, suitable for electronic substrate manufacturing.
Intrinsic high-efficiency flame retardancy - Chemically grafted bromine, UL94 V-0 grade, long-lasting and stable effect
High solid content & low viscosity - 80% high solid content formula, balancing substrate wettability and processability
High Tg & excellent performance - High glass transition temperature after curing, outstanding thermal and dimensional stability
Strong substrate adhesion - Good wettability on copper foil and glass fiber cloth, firm bonding with excellent interlayer adhesion
Wide formula compatibility - Good compatibility with curing agents like dicyandiamide, flexible formula adjustment
High-end Copper Clad Laminate (CCL) - Core resin substrate for manufacturing high-performance flame-retardant CCL
Printed Circuit Board (PCB) - Suitable for PCB substrate manufacturing and solder mask, enhancing flame retardancy
Electronic substrate adhesives - Structural bonding of copper foil and glass fiber cloth in CCL production
Consumer electronics protection - Moisture and corrosion protective coatings for home appliance PCBs
Precision electronic packaging - Flame-retardant packaging materials for small electronic components
| Solid Content (%) | 80±2 |
| Bromine Content (%) | 43-47 |
| Epoxy Equivalent (g/eq) | 440-460 |
| Epoxy Value (eq/kg) | 2.17-2.27 |
| Viscosity (25℃, mPa·s) | 120-280 |
| Solvent Type | Acetone |
| Color (Gardner) | ≤2 |
| Density (20℃, g/cm³) | 1.14-1.19 |
| Flame Retardant Rating (UL94) | V-0 |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China